Comment by krisoft
Wait, wait. In the context of semiconductor manufacturing packaging does not mean what you think it means. It is not putting the product in a paper box.
It is about cutting the wafer into individual chips, wire bonding the silicone to pins, and covering the whole thing with epoxy.
Here is a video which explains it better: https://www.youtube.com/watch?v=7gg2eVVayA4
It would be indeed crazy if they would ship the ready chips to Taiwan just to be put in a paper box.
basically the input of the process is a wafer which looks like this: https://waferpro.com/wp-content/uploads/2016/08/Patterned-Lo...
And the output of the process is something which looks like this: https://res.cloudinary.com/rsc/image/upload/b_rgb:FFFFFF,c_p...
The packaging in this context is not wire bonding but CoWoS - chip-wafer and wafer-wafer bonding.