Comment by VWWHFSfQ
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Two points to counter the snark:
1. The output of a "chip manufacturing" process is a wafer. There is absolutely further assembly (bonding, packaging) done on this output.
2. The chips themselves are not for the end user's consumption. They are assembled into a product, a "consumer electronic".
The dies themselves are "assembled" - cut from the wafer, bonded to the wires (or solder bumps) that carry signals to the rest of the system, and packaged for physical protection and thermal management.
In recent times, multi-chiplet architecture has added its own layer of complexity to that process.
See also: OSAT.
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